🇸🇬 Singapore · GeBIZ contract award · NST000ETT25000064

Provision of One (1) or More Units of Physical Vapor Deposition (PVD) Cluster tool(s) for Through Silicon Via (TSV) barr

S$13.1M Awarded value

2025-11-27 Award date

1 Sectors

Contract description

Provision of One (1) or More Units of Physical Vapor Deposition (PVD) Cluster tool(s) for Through Silicon Via (TSV) barriers-seed layers, Redistribution Layer (RDL) barrier-seed layers and Back-End of Line (BEOL) metallization on 300mm wafers.

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Provision of One (1) or More Units of Physical Vapor Deposition (PVD) Cluster tool(s) for Through Silicon Via (TSV) barr

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