🇸🇬 Singapore · GeBIZ contract award · NST000ETT21000029

Provision of One Unit of Fine Pitch Hybrid Bonder and/or One Unit of Wafer Level Temporary Adhesive Bonding Tool

S$11.6M Awarded value

2022-04-15 Award date

1 Sectors

Contract description

Provision of One Unit of Fine Pitch Hybrid Bonder and/or One Unit of Wafer Level Temporary Adhesive Bonding Tool

Connected to.

Buying agency

Agency for Science, Technology and Research

Winning supplier

EV Group Europe & Asia/Pacific GmbH

Sectors

Country

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