🇸🇬 Singapore · GeBIZ contract award · NST000ETT25000033

Provision of One (1) Unit of Fully Automated Die-to-Wafer Surface Preparation Equipment and/or Die-to-Wafer Bonder

S$4.9M Awarded value

2026-03-04 Award date

1 Sectors

Contract description

Provision of One (1) Unit of Fully Automated Die-to-Wafer Surface Preparation Equipment and/or Die-to-Wafer Bonder

Connected to.

Buying agency

Agency for Science, Technology and Research

Winning supplier

APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD.

Sectors

Country

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